Products
Semiconductor materials, supplied from the United States.
Hillsboro-made silicon carbide and CMP slurry, plus AGC Group photolithography, sealing, advanced-packaging, and life-sciences materials distributed across North America.
Products
Hillsboro-made silicon carbide and CMP slurry, plus AGC Group photolithography, sealing, advanced-packaging, and life-sciences materials distributed across North America.
Manufactured in Hillsboro
Flagship products
Silicon Carbide
ROICERAM™-HS
Silicon carbide ceramic components, recrystallized and CVD-coated, for vertical, horizontal, and single-wafer semiconductor furnace processes.
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CMP Slurry
CES-300 / CES-330F
Ceria-based slurries for chemical-mechanical planarization (CMP). Shallow-trench isolation, interlayer dielectric, and front-end / back-end / packaging processes.
Read the product pageAGC Group lines
Photolithography
EUV Mask Blanks
Low-thermal-expansion glass substrates with optical coatings. The foundation of every EUV photomask used in advanced semiconductor lithography.
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Photomask Substrates
AQ Grade
AQ-grade synthetic quartz substrates engineered for photomask manufacturing. Sub-100nm flatness per side and exceptionally low defect counts.
Read the product page Synthetic Quartz for ArF & LCD Steppers
AQ / AQ2 / AQ3 / AQT / AQR / QJ / QC-i
Synthetic fused-silica glass grades engineered for deep-UV photolithography. From photomask substrates and glass wafers to projection and illumination optics for ArF excimer-laser steppers.
Read the product page Quartz Wafers
AQ / QJ Grade
Square and round high-purity synthetic-quartz wafers in AQ and QJ grades, 4–12 inches, 0.5–3.0 mm thick.
Read the product pageAGC Group lines
Sealing
AGC Group lines
Advanced Packaging
EN-A1 Glass for TGV, WLP, and MEMS
Alkali-free boro-aluminosilicate interposer glass engineered for high-via-count TGV, WLP, and MEMS applications. Low CTE, low-taper laser drilling, excellent chemical resistance.
Read the product page Synthetic Quartz Wafers for HF Interposers
AQ Synthetic Fused Quartz
AQ synthetic fused-quartz wafers for high-frequency wafer-level packaging. Extremely low dielectric loss, isotropic RF properties, hermetic sealing for MICs and hybrids.
Read the product pageAGC Group lines
