AGC Electronics America
Semiconductor materials, made in Hillsboro, Oregon.
Precision semiconductor materials, manufactured in the United States and supplied to global fabs.
Explore our products AGC Electronics America
Precision semiconductor materials, manufactured in the United States and supplied to global fabs.
Explore our productsFlagship products
Made in Hillsboro
Our two flagship product lines, ROICERAM silicon carbide and CES-300/330F CMP slurry, are manufactured in the United States at our Hillsboro, Oregon facility and supplied directly to global semiconductor customers.
Flagship
Silicon Carbide
ROICERAM™-HS
Silicon carbide ceramic components, recrystallized and CVD-coated, for vertical, horizontal, and single-wafer semiconductor furnace processes.
See the ROICERAM page
Flagship
CMP Slurry
CES-300 / CES-330F
Ceria-based slurries for chemical-mechanical planarization (CMP). Shallow-trench isolation, interlayer dielectric, and front-end / back-end / packaging processes.
See the CES-300 page
Hillsboro, Oregon
Headquartered in Hillsboro, founded in 1997. We have manufactured semiconductor materials on this Pacific Northwest site for more than 25 years.
Manufactured in the USA
Our flagship silicon carbide and CMP slurry lines are made in the United States, giving North American semiconductor customers a domestic supply chain backed by global capacity.
ISO 9001:2015
Our quality management system is certified by BSI. Every product line shipping from Hillsboro is governed by the same documented quality controls.
Part of the AGC Group
We are a Group company of AGC Inc., the global glass and materials company headquartered in Tokyo. The AGC Group brings the R&D depth; we bring the US supply chain.
AGC Group product lines, served from North America
Beyond Hillsboro
We also serve North American customers with AGC Group product lines manufactured at AGC sites in Japan and elsewhere, from EUV mask blanks to advanced packaging glass.
4 product lines
Photolithography
EUV mask blanks, photomask substrates, synthetic quartz for ArF and LCD steppers, and quartz wafers.
Explore photolithography1 product line
Sealing
Pb-free, low-melting glass frits, pastes, and custom preforms for hermetic sealing.
Explore sealing materials2 product lines
Advanced Packaging
EN-A1 interposer glass for TGV, WLP, and MEMS, plus AQ synthetic quartz for high-frequency interposers.
Explore packaging materials1 product line
Life Sciences
EN-A1 and AQ glass for Lab-on-a-Chip, DNA microreactors, and micro-nano sensors.
Explore life-sciences glassBring your next requirement to Hillsboro
Our Hillsboro team is the right starting point for any AGCEA or AGC Group product. We route your inquiry to the right technical contact within one business day.
Talk to AGCEA