Processed semiconductor wafer with rainbow diffraction, an HF interposer application

Advanced Packaging

Synthetic Quartz Wafers for HF Interposers (AQ Synthetic Fused Quartz)

AQ synthetic fused quartz wafers for high-frequency interposers and wafer-level packaging. Extremely low dielectric loss and isotropic RF properties from RF through millimeter-wave to terahertz.

AGC’s AQ synthetic fused quartz is purpose-built for high-frequency (HF) interposers, RF interposers, and stand-alone substrates from RF through millimeter-wave and into terahertz, including 5G and emerging 6G applications. Its extremely low dielectric loss and low dielectric constant let RF designers achieve circuit performance that wasn’t previously possible with traditional substrate materials.

Why AQ for high-frequency packaging

  • Hermetic packaging for Microwave Integrated Circuits (MICs), hybrids, and microwave assemblies. When these devices are exposed to wide ranges of temperature and humidity, AQ maintains stable dielectric constant and loss; performance does not drift with the environment.
  • Isotropic RF properties. Tangent loss and dielectric constant are equal in every direction. This opens up unique device designs and packaging formats that haven’t been achievable in the microwave industry before.

What it’s being used for

Where designers need RF substrates that match their device performance and survive aerospace, defense, and 5G/6G environmental envelopes, and where the loss tangent of standard substrates would compromise system gain or noise figure, AQ synthetic fused quartz is the substrate to specify.

Applications

  • High-frequency wafer-level packaging from RF through millimeter-wave to terahertz
  • Hermetic packaging for Microwave Integrated Circuits (MICs) and hybrids
  • Stand-alone microwave assembly substrates

Documents

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Specifications

Detailed specifications available on request. Use the form below.

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