EN-A1 Glass for TGV, WLP, and MEMS

EN-A1 is an alkali-free boro-aluminosilicate interposer glass with engineering properties tuned for the demanding requirements of next-generation advanced packaging, heterogeneous integration, and electronics packaging. It enables through-glass vias (TGV), wafer-level packaging (WLP), and MEMS substrate applications that organic substrates can’t meet, and gives circuit designers flexibility that wasn’t available before in glass-based interposer substrates.

Why EN-A1

• The premier interposer for high-via-count applications. EN-A1’s combination of mechanical and dielectric properties supports dense via patterns without the failure modes that limit competing materials.
• Excellent chemical resistance. Because it is a glass, EN-A1 is inert to most aggressive process chemistries.
• Low CTE. Provides a stable foundation as your design experiences thermal cycling during reliability testing and end-use.
• Proprietary refractive properties. These enable a particularly low taper when EN-A1 is laser-drilled, giving you precise pitch control and consistent hole sizes. The result is the high via counts that your design needs.

Where it’s being used

Next-generation interposers for entertainment, communications, and display products. Anywhere that an organic substrate would fail to meet the dimensional stability, dielectric performance, or via-count requirements of the target application.

Applications

• Through-Glass Vias (TGV) for next-generation interposers
• Wafer-Level Packaging (WLP) substrates
• MEMS device substrates
• High-via-count communication and display devices

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